XENOM is moving from a contract model to in-house production. The company has commissioned a manufacturing complex and R&D center in Guangdong Province (PRC), operating under Foshan Xenom Technology Co., Ltd.
The current facility area is 1,200 m² with infrastructure potential for scaling up to 4,200 m² and a design capacity of up to 20,000 units per month.
The new site brings together electronics development, rapid prototyping, PCB assembly, final assembly, climatic testing, and quality control under unified management.
Key advantages of vertical integration
• Ultra-short R&D cycle ("idea — prototype — series")
For a product at the intersection of mechanics, sensors, connectivity, positioning, and AI algorithms, the speed of hypothesis validation is critical. Engineering refinements, sample fabrication, and field tests now take place at a single location without waiting for production windows at third-party factories.
• End-to-end quality control and traceability
A unified management system covers the entire loop: from incoming component inspection and PCB soldering to firmware flashing, sealing, and final testing of the finished product.
• In-house pre-certification laboratory
The testing facility is equipped for stress tests according to international safety standards: EN 397 (European Union), ANSI/ISEA Z89.1 (USA), and CSA Z94.1 (Canada), including climatic checks at temperatures down to −30 °C. This reduces the number of external iterations and accelerates entry into international markets.
• Direct control of economics and scaling
Eliminating contract assembler margins and directly controlling supply chains makes the cost structure transparent and manageable as production volumes grow.